Intel Wins US Government Advanced Packaging Project

What’s New: The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program. The SHIP program enables the U.S. government to access Intel’s state-of-the-art semiconductor packaging capabilities in Arizona and Oregon and take advantage of capabilities created by Intel’s tens of billions of dollars of annual R&D and manufacturing investment. The project is executed by the Naval Surface Warfare Center, Crane Division, and administered by the National Security Technology Accelerator.

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Intel’s newest, leading-edge manufacturing facility is Fab 42 in Ocotillo, Arizona. Fab 42 connects to three other Intel fabrication plants, making the site Intel’s first mega-factory network. It manufactures our newest generation of leadership products that will power hundreds of millions of computing devices worldwide. (Credit: Intel Corporation)

“Intel and the U.S. government share a priority to advance domestic

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